Mesh Pattern Diamond Cut and Grind Blade
Model: DSB-115125-S-T-MS
Product Type: Double-sided hot-pressed diamond cutting and grinding blade with dense mesh working pattern.
Available Sizes: 115 mm and 125 mm.
Bore: 22.23 mm.
Working Layer Thickness: 1.6 mm.
Working Layer Height: 25 mm.
Blade Shape and Function: The dense cross-lattice mesh spreads diamond contact across the wide 25 mm working area. Interconnected channels provide continuous chip evacuation while the uniform surface helps reduce vibration and local pressure peaks, producing a smooth and controllable grinding action.
Applications: Ceramic tile, porcelain, gres, Dekton-type sintered stone, marble, quartz and engineered stone.
Recommended Operations: Straight cutting, 45° mitre cutting, chamfering, edge correction and fine edge grinding with a compatible angle grinder. Suitable for dry or wet operation.
Advantages:
• Dense mesh pattern for uniform contact
• Reduced vibration and stable edge control
• Smooth transition between cutting and grinding
• 1.6 mm thickness and 25 mm working height
• Available in 115 mm and 125 mm
Confirm maximum RPM and machine compatibility before use.
