Mesh Pattern Diamond Cut and Grind Blade
Model: DSB-115125-S-T-MS
Product Type: Double-sided hot-pressed diamond cutting and grinding blade with dense mesh working pattern.
Available Sizes: 115 mm and 125 mm.
Bore: 22.23 mm.
Working Layer Thickness: 1.6 mm.
Working Layer Height: 25 mm.
Blade Shape and Function: The dense cross-lattice mesh spreads diamond contact across the wide 25 mm working area. Interconnected channels provide continuous chip evacuation while the uniform surface helps reduce vibration and local pressure peaks, producing a smooth and controllable grinding action.
Applications: Ceramic tile, porcelain, gres, Dekton-type sintered stone, marble, quartz and engineered stone.
Recommended Operations: Straight cutting, 45° mitre cutting, chamfering, edge correction and fine edge grinding with a compatible angle grinder. Suitable for dry or wet operation.
Advantages:
• Dense mesh pattern for uniform contact
• Reduced vibration and stable edge control
• Smooth transition between cutting and grinding
• 1.6 mm thickness and 25 mm working height
• Available in 115 mm and 125 mm
Confirm maximum RPM and machine compatibility before use.
Select Your Mesh Cut and Grind Blade
Choose 115 mm or 125 mm and confirm the 22.23 mm bore against your machine. Specify whether you need straight cutting, 45-degree mitre preparation, chamfering or fine edge correction. Share the tile or slab material and thickness, along with the edge finish you want to achieve.
Request Mesh Blade Pricing and Samples
Reference model: DSB-115125-S-T-MS.
Diameter and quantity per size.
Material, slab thickness and target edge profile.
Machine model, operating speed and wet or dry setup.
Sample quantity, destination country and packaging requirements.
For sample evaluation, include a photo of the current cut edge and describe any chipping, edge marks or finishing issue you want to improve. For private-label enquiries, send your logo and packaging requirements so we can check the available options.
Request Mesh Cut & Grind Blade Pricing
